VIA Technologies

VIA Technologies Inc.
威盛電子
Subsidiary
Industry Computer hardware
Founded 1987 (1987)
Fremont, California, United States
Headquarters New Taipei City, Taiwan, ROC
Products Chipsets, motherboards, CPUs
Parent Formosa Plastics Group
Website VIA.com.tw

VIA Technologies Inc. (Chinese: 威盛電子; pinyin: Wēishèng Diànzǐ) is a Taiwanese manufacturer of integrated circuits, mainly motherboard chipsets, CPUs, and memory, and is part of the Formosa Plastics Group. It is the world's largest independent manufacturer of motherboard chipsets. As a fabless semiconductor company, VIA conducts research and development of its chipsets in-house, then subcontracts the actual (silicon) manufacturing to third-party merchant foundries, such as TSMC.

History

The company was founded in 1987, in Fremont, California, USA by Cher Wang. In 1992, it was decided to move the headquarters to Taipei, Taiwan in order to establish closer partnerships with the substantial and growing IT manufacturing base in Taiwan and neighbouring China.[1]

In 1999, VIA acquired most of Cyrix, then a division of National Semiconductor. That same year, VIA acquired Centaur Technology from Integrated Device Technology, marking its entry into the x86 microprocessor market. VIA is the maker of the VIA C3, VIA C7 & VIA Nano processors, and the EPIA platform. The Cyrix MediaGX platform remained with National Semiconductor.

In 2001, VIA established the S3 Graphics joint venture.

In January 2005, VIA began the VIA pc-1 Initiative, to develop information and communication technology systems to benefit those with no access to computers or Internet. In February 2005, VIA celebrated production of the 100 millionth VIA AMD chipset.

On 29 August 2008, VIA announced that they would release official 2D accelerated Linux drivers for their chipsets, and would also release 3D accelerated drivers.[2]

Products

A VIA USB PHY on a Rosewill branded PCI USB 2.0 Desktop Expansion card
A VIA Envy Sound Card for PC. PCI Slot 5.1 Channel

VIA's business focuses on integrated chipsets for the PC market. Among PC users, VIA is best known for its motherboard (core-logic) chipsets. However, VIA's products include audio controllers, network/connectivity controllers, low-power CPUs, and even CD/DVD-writer chipsets. PC and peripheral vendors such as ASUS then buy the chipsets for inclusion into their own product brands.

In the late 1990s, VIA began diversifying its core-logic business, and the company has since made business acquisitions to form a CPU division, graphics division, and a sound division. As advances in silicon manufacturing continue to increase the level of integration and functionality in chipsets, VIA will need these divisions to remain competitive in the core-logic market.

Audio circuits

Circuit Sampling rate Resolution
Digital Analog Digital Analog
VT1613 96 kHz 96 kHz 20-bit 20-bit
VT1618 96 kHz 96 kHz 20-bit 20-bit
VT1708B 96 kHz 192 kHz 24-bit 24-bit

Processors

Series Model Core Frequency
[MHz]
Front Side Bus
[MHz]
Year Process
[nm]
Die size
[mm^2]
Power
[W]
L2 Cache
[K]
L1 I/D Cache
[K]
Performance
[SPEC2000]
Eden Eden ESPSamuel 2 300–60066/100/133200115035×352.5–66464/64
Eden ESPNehemiah 667–1000133/2002003–200413035×356–76464/64
Eden-NNehemiah 533–1000133200313015×152.5–76464/64
EdenEsther 400–1500400–8002006–20079030<7.512832/32
Eden X2? 800?20114011×6??
C3 C3Samuel 2 667–800100–1332001150136464/64
C3Ezra 800–1000100–13320021308.3–106464/64
C3Nehemiah 1000–1400133–200200313035×3515–216464/64
C3-MNehemiah 1000–1400133–200200313035×3511–196464/64
C7 C7-DEsther 1500–180040020069021×2120–2512816/16
C7-MEsther 1000–200040020059021×2112–2012816/16
C7Esther 1500–200080020079021×2112–2012816/16
QuadCore QuadCoreIsaiah 1000-1460106620114021×2127.54× 1024[3]4× 64/6430.1/24.1 rate[4]

VIA PadLock

The VIA PadLock Security Engine is implemented in most recent VIA x86 processors. It contains at least a hardware random number generator. The C5P core gained AES acceleration on top of the random number generator, using a different instruction set than Intel AES-NI. The C5J "Esther" core has SHA-1 and SHA-256 acceleration and a Montgomery multiplier as well. A Montgomery modular multiplier can be used to speed up asymmetric encryption such as RSA signing and decryption. Finally the C5P "Esther" core also contains NX bit security which VIA considers a component of the PadLock suite. The difference with the other features is that it doesn't provide additional functionality to the user.[5]

Chipsets

Main article: List of VIA chipsets

VX900

[6]

  • Supported processors
  • VIA Nano™, VIA Nano 3000 Series™, VIA C7®-M processor, VIA Eden™ processors
  • V4 protocol supporting 800/533/400MHz FSB
  • Memory controller
  • Supports up to two unbuffered 32/64-bit DIMMs
  • DDR3 1066MHz / DDR2 667
  • Unified video decoding processor
  • WMV / VC1 Video Decoding Mode
  • VC-1 SP/MP/AP up to level 3.0
  • Accelerates AP@L3 from VLD or iDCT
  • De-blocking filtering
  • Adaptive macroblock quantization
  • H.264 decode mode
  • Accelerates MP@L4.1 H.264 stream from VLD level
  • Multi-mode, multi-reference MC
  • Interlaced frame / MBAFF decoding
  • CAVLC and CABAC support
  • Inner loop de-block filter
  • BP/MP/HP (CABAC or CAVLC) up to level 4.1
  • MPEG-2 decoding mode
  • Fully compatible ISO/IEC spec in main profile
  • Supports VLD
  • XVID
  • Interlaced frame decoding
  • Supports 1/4 –pixel MC
  • High Definition Audio Interface
  • Up to 32-bit sample depth at 192 kHz sampling rate
  • Supports three independent codecs streams
  • Supports jack sensing and retasking
  • Integrated 2D graphics processor
  • 128-bit 2D engine with hardware rotation capability
  • High Definition video processor with VMR capability
  • Up to 256 MB frame buffer

  • Integrated 3D graphics processor
  • 250MHz engine clock
  • VIA Chrome9 HC3 – programmable DirectX 9 graphics engine
  • 128-bit DX9 graphics engine with 2PS and 2VS
  • Internal full ARGB for high rendering quality
  • Display support
  • Dedicated CRT interface
  • Single channel LVDS transmitter
  • DVP1 to external HDMI/LVDS/DVI transmitter and TV encoder
  • Multiplexed interface for DisplayPort/HDMI
  • Multiplexed interface for DisplayPort/PCI Express
  • Supports DuoView+ dual image capability
  • Video capture port
  • Parallel and serial Transport Stream inputs
  • Supports 8-bit or 16-bit CCIR656/601 input
  • External Hsync / Vsync support
  • Supports HD resolution up to 1080i 60 or 1080p 30
  • Storage and Peripheral Interface
  • 2× SATA 2.0 interface
  • Support SD/MMC/MS/MS pro memory card interface
  • Supports PCI-Express one 4-lane and two 1-lane ports
  • Supports eight USB 2.0 ports
  • Supports PCI and LPC buses
  • Supports SDIO and SPI
  • Supports four UART ports
  • Power management
  • ACPI 3.0 and PCI Bus Power Management 1.1 compliant
  • Extensive system power management

VN1000

[7]

  • Processor support
  • VIA Nano, VIA C7, C7-D and Eden™ (V4) processors
  • PowerSaver™ support
  • Yes
  • VIA V4 bus
  • 400/800 MHz
  • Memory support
  • DDR2 677/800 and DDR3 800/1066
  • Max. memory
  • 16GB
  • PCI Express
  • One 8-lane, four 1-lane
  • North/South Bridge Link
  • Ultra V-Link (1 GB/s)
  • Graphics core
  • VIA Chrome 520
  • DirectX graphics
  • DirectX10.1
  • Video acceleration
  • H.264, WMV, MPEG-2
  • HDTV support
  • Yes – HDTV resolutions inc 1080p, 1080i and 720P
  • Multi-display support
  • Yes – including dual HDMI DisplayPort and LVDS

VIA established itself as important supplier of PC components with its chipsets for Socket 7 platform. With the Apollo VP3 chipset VIA pioneered AGP support for Socket 7 processors.[8] VIA's present market position derives from the success of its Pentium III chipsets. Intel discontinued the development of its SDRAM chipsets, and stated as policy that only RAMBUS memory would be supported going forward. Since RAMBUS was more expensive and offered few, if any, obvious performance advantages, manufacturers found they could ship performance-equivalent PCs at a lower cost by using VIA chipsets.

In response to increasing market competition, VIA decided to buy out the ailing S3 Graphics business. While the Savage chipset was not fast enough to survive as a discrete solution, its low manufacturing cost made it an ideal integrated solution, as part of the VIA northbridge. Under VIA, the S3 brand has generally held onto a 10% share of the PC graphics market, behind Intel, ATI, and Nvidia. VIA also includes the VIA Envy soundcard on its motherboards, which offers 24-bit sound. While its Pentium 4 chipset designs have struggled to win market share, in the face of legal threats from Intel, the K8T800 chipset for the Athlon 64 has been popular.

VIA has also continued the development of its VIA C3 and VIA C7 processors, targeting small, light, low power applications, a market space in which VIA is successful. In January 2008, Via unveiled the VIA Nano, an 11 mm × 11 mm footprint VM-enabled x86-64 processor, which debuted in May 2008, for ultra-mobile PCs.

On the basis of the IDT Centaur acquisition,[9] VIA appears to have come into possession of at least three patents, which cover key aspects of processor technology used by Intel. On the basis of the negotiating leverage these patents offered, in 2003, VIA arrived at an agreement with Intel that allowed for a ten-year patent cross license, enabling VIA to continue to design and manufacture x86 compatible CPUs. VIA was also granted a three-year grace period in which it could continue to use Intel socket infrastructure.

See also

References

  1. "Corporate History - VIA Technologies, Inc.". via.com.tw. Retrieved 3 January 2014.
  2. "VIA Releases FOSS Graphics Driver". Slashdot. 31 August 2008. Retrieved 3 January 2014.
  3. "VIA QuadCore Processor". Via.com. Retrieved 2014-02-03.
  4. "VIA Nano X2 Whitepaper" (PDF). Via.com. Retrieved 2014-02-03.
  5. "What is VIA PadLock? - VIA Technologies, Inc.". via.com.tw. Retrieved 2015-06-28.
  6. "VIA VX900 Chipset". Via.com. Retrieved 2014-02-03.
  7. "VIA VN1000 Chipset". Via.com. Retrieved 2014-02-03.
  8. "VIA and Intel Settle Patent Infringement Cases". VIA Technologies, Inc. Retrieved 2007-03-12.
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