Thin Small Outline Package

An outline drawing of a Type I TSOP with 32 leads

Thin Small Outline Package, or TSOP is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, Flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC Cards (PCMCIA cards), wireless, netbooks and countless other product applications.

TSOP is the smallest leaded form factor for flash memory.^[1]

Physical properties

TSOP type I: Atmel AT29C010A

TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. ^[2]

Type I

Part Number	Pins	Body Width/mm	Body Length/mm	Lead Pitch/mm
TSOP28	28	8.1	11.8	0.55
TSOP28/32	28/32	8	18.4	0.5
TSOP40	40	10	18.4	0.5
TSOP48	48	12	18.4	0.5
TSOP56	56	14	18.4	0.5

Type II

Part Number	Pins	Body Width/mm	Body Length/mm	Lead Pitch/mm
TSOP20/24/26	20/24/26	7.6	17.14	1.27
TSOP24/28	24/28	10.16	18.41	1.27
TSOP32	32	10.16	20.95	1.27
TSOP40/44	40/44	10.16	18.42	0.8
TSOP50	50	10.16	20.95	0.8
TSOP54	54	10.16	22.22	0.8
TSOP66	66	10.16	22.22	0.65

Similar packages

There are a variety of small form-factor IC carrier available other than TSOPs

Small-outline integrated circuit (SOIC)
Plastic small-outline package (PSOP)
Shrink small-outline package (SSOP)
Thin-shrink small outline package (TSSOP)

References

↑ Intel. "Small Outline Package Guide". 1999. p. 1-1.
↑ SiliconFarEast: "TSOP - Thin Small Outline Package"

External links

Semiconductor packages

Diode	DO-204 (DO-35 / DO-41) DO-213 (MELF) DO-214 (SMA / SMB / SMC) SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)

Transistor	SOT / TSOT TO-3 TO-5 TO-18 TO-66 TO-92 TO-126 TO-220 TO-253 (DPAK) TO-263 (D2PAK)

Single row	SIP / SIL

Dual row	DFN DIP / DIL Flat Pack SO / SOIC SOP / SSOP TSOP / TSSOP ZIP

Quad row	LCC PLCC QFN QFP QUIP / QUIL

Grid array	BGA eWLB LGA PGA

Wafer	COB COF COG CSP Flip Chip PoP QP UICC WL-CSP / WLP

Related topics	Electronic packaging Integrated circuit packaging List of integrated circuit package dimensions List of integrated circuit packaging types Printed circuit board Surface-mount technology Through-hole technology

Note: It's relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.

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