Product binning
In semiconductor device fabrication, product binning is the categorizing of finished products based on their characteristics.[1]
Definition
Semiconductor manufacturing is an imprecise process, sometimes achieving as low as 30% yield.[2] Defects in manufacturing are not always fatal, however; in many cases it is possible to salvage part of a failed batch of integrated circuits by modifying performance characteristics. For example, by reducing the clock frequency or disabling non-critical parts that are defective, the parts can be sold at a lower price, fulfilling the needs of lower-end market segments.
This practice occurs throughout the semiconductor industry on products such as CPUs, RAM and GPUs.
Speed Bump
A speed bump, in computer terms, is a slight increase in frequency (e.g., from 1.8 to 1.9 GHz) or a slight increase in functionality (e.g. Nvidia GeForce GTX260 to GTX260 Core 216[2]). Some time after the initial release of a product, manufacturers may choose to increase the clock frequency of an integrated circuit for a variety of reasons, ranging from improved yields to more conservative speed ratings (e.g., actual power consumption lower than TDP).
Testing
In order to undergo binning, manufactured products require testing. Finished products enter a machine[3][4] that can test hundreds of pieces at a time, taking only a few hours to complete. Each piece can be tested to determine its highest stable clock frequency and accompanying voltage and temperature while running.[1][4]
Marketing
Binning allows large variances in performance to be condensed into a smaller number of marketed designations. This ensures coherency in the marketplace, with tiers of performance clearly delineated. The immediate consequence of this practice is that, for liability reasons, products sold under a certain designation must meet that designation at a minimum. Individual products may still exceed advertised performance.
Overclocking
Since manufacturers are only required to meet the minimum advertised specifications, the potential for overclocking of a product is not typically tested during the binning process.[5] Therefore, it should not be assumed that higher-rated products will overclock better than lower-rated ones.
Examples
A notorious example of product binning happened in some AMD processors. Upon testing, certain AMD processors can be found with defective or sub-par cores present on the silicon. Instead of scrapping the whole processor, the defective core is simply disabled but left intact and the remaining silicon is marketed as a lower tier product. However due to some loophole in the timing system those disabled core can be turned back on when coupled to certain motherboards, revealing the underlying binning process. Intel does the same binning, but since Intel physically destroy the disabled portions of the chip, it is impossible to turn those portions back on.
References
- 1 2 Goodhead, Paul (10 June 2010). "How to Make a CPU - Testing, Packaging and Binning". bit-tech.net. Retrieved 2013-02-24.
- 1 2 Lal Shimpi, Anand (2 December 2008). "The RV770 Story: Documenting ATI's Road to Success". AnandTech.
- ↑ http://www.legitreviews.com/images/reviews/719/centaur_thermo.jpg
- 1 2 "Centaur Technologies Tour - Making The Via Nano CPU - VIA Nano Testing". Legit Reviews. 2008-06-02. Retrieved 2013-02-24.
- ↑ "Corsair Vengeance 8GB DDR3 Low Voltage 1600MHz Review - Final Thoughts and Conclusion". Legit Reviews. 2011-12-05. Retrieved 2013-02-24.
External links
- Philips Lumileds LUXEON Application Brief: an example of a documented binning structure